IMPROVING THE QUALITY OF FINISHING ABRASIVE TREATMENT OF SILICON CARBIDE PLATES
Authors:
1.
Bryansk State Technical University
(Department of Transport Engineering, Post graduate student)
Bryansk, Bryansk, Russian Federation
Bryansk, Bryansk, Russian Federation
Type:
Сonference article
Published:
13.04.2020
Subject area:
VAC 05.02.2000 Машиностроение и машиноведение
UDK 62 Инженерное дело. Техника в целом. Транспорт
UDK 65 Управление предприятиями. Организация производства, торговли и транспорта
GRNTI 55.01 Общие вопросы машиностроения
UDK 62 Инженерное дело. Техника в целом. Транспорт
UDK 65 Управление предприятиями. Организация производства, торговли и транспорта
GRNTI 55.01 Общие вопросы машиностроения
Language:
Russian
Keywords:
silicon carbide abrasive processing, the quality of the surface structures
Abstract (English):
mechanical processing of ceramic materials in practice is a complex technological task, due to the high hardness and increased brittleness of the processed material. High-quality, high-performance grinding of ceramics requires a reasonable selection of operating parameters of the technological process, as well as the identification of factors that violate the integrity of the surface and deep layers of the processed material, which, in turn, will meet the high requirements for the production of batches of suitable semiconductor products. The author of scientific research performed a series of experiments on processing silicon carbide plates with varying cutting modes and conditions. The obtained research results will serve as a basis for the formulation and promotion of individual recommendations for the treatment of silicon carbide structures with the required quality of the surface layer at the proper level of productivity of the technological process.
mechanical processing of ceramic materials in practice is a complex technological task, due to the high hardness and increased brittleness of the processed material. High-quality, high-performance grinding of ceramics requires a reasonable selection of operating parameters of the technological process, as well as the identification of factors that violate the integrity of the surface and deep layers of the processed material, which, in turn, will meet the high requirements for the production of batches of suitable semiconductor products. The author of scientific research performed a series of experiments on processing silicon carbide plates with varying cutting modes and conditions. The obtained research results will serve as a basis for the formulation and promotion of individual recommendations for the treatment of silicon carbide structures with the required quality of the surface layer at the proper level of productivity of the technological process.
Keywords:
silicon carbide abrasive processing, the quality of the surface structures
silicon carbide abrasive processing, the quality of the surface structures
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