UDC 62

TECHNOLOGICAL MODE CHOICE FOR SILICON CARBIDE PLATE DIAMOND ABRASION Technological mode choice for silicon carbide plate diamond abrasion

Published in Science intensive technologies in mechanical engineering · Volume 2020, Issue 12 · Pages 3–6 · Rubric: SCIENCE INTENSIVE TECHNOLOGIES OF MACHINING (archived)
DOI: https://doi.org/10.30987/2223-4608-2020-12-3-6
Received: 18.11.2020 Accepted: 27.11.2025
There is stated a choice of a technological mode for diamond abrasion ensuring a required process capacity and silicon carbide plate quality. The correlations of a silicon carbide removal rate with the length of surface micro-cracks with the roughness height of a surface are stated. A procedure is offered for setting technological modes which do not result in plate billet destruction during manufacturing special devices.
diamond abrasion capacity, micro-cracks, surface roughness, silicon carbide plates
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