TY  JOUR
TI  INVESTIGATING THE REMOVAL RATE OF PYROGENIC SiO2  BY PLASMA CHEMICAL ETCHING
KW  etching
KW  removal rate
KW  pyrogenic SiO2
KW  pressure
KW  power
KW  gases
KW  temperature
KW  reactive ion plasma-chemical etching unit
JO  Automation and modeling in design and management
AU  Adamov, A.A.
AU  Golovko, A.S.
AU  Malakhanov, A.A.
AU  Vasil'eva, Y.O.
AU  Pavlov, A.V.
PY  2024
IS  2024
PB  Bryansk State Technical University